![]() On the other hand, let’s assume that an SiP is like an apartment building, with each flat built one on top of the other. The space occupied by these houses is a lot since they’re spread across a colony next to one another. Each house is built in the same way, next to one another. Let’s say that an SoC is a row of individual houses in a colony. Let’s try to explain this using a simple analogy. What this also means, is that since the SiP is not just a single chip, the individual ICs are manufactured using separate dies which means that every part of the chip can be manufactured using a different process. This saves space as the ICs need not be spread across the PCB, and as the chips themselves have extremely small thicknesses, stacking them up does not increase the overall thickness by much. On the other hand, the SiP does not contain all the components in one single IC but instead has multiple chips stacked on top of one another. ![]() are all manufactured on the same process as the entire SoC is manufactured using just one single die. Which means, when we say that the Snapdragon 855 is based on the 7nm manufacturing process, it means that the CPU, GPU, RAM etc. Since an SoC is basically all components on an IC (Integrated Circuit), every component is manufactured on the same manufacturing process. How is an SiP different from SoC? Image: While one may argue that an SoC is also exactly the same, the main difference lies in the manufacturing process as well as the physical size and space occupied by them. What this essentially means is that all the major components that assist in the working of the phone are integrated into a single package which is then soldered onto the motherboard. SiP, as stated earlier, stands for System-in-Package. The Apple Watch’s “S” series chips, for example, are SiPs since the space constraint in a watch is very high, but not a lot of people are aware of this fact. While SiPs aren’t new, the usage of this technology in smartphones is, as it wasn’t until Qualcomm very recently launched its Snapdragon SiP 1 chipset which made its debut in Asus’ latest phones launched in Brazil, the Zenfone Max Shot and Max Plus M2, that this technology was heard of on a large scale. This is where SiPs or a System-in-Package comes into the picture. However, as smartphones keep getting more and more powerful, the need to include more components such as larger batteries, multiple cameras, and cameras with large sensor sizes is increasing, but the overall form-factor of a smartphone needs to be maintained at a manageable size. The reason SoCs were adopted is that they take up much lesser space which is a basic necessity in a smartphone due to size constraints. ![]() Smartphones have traditionally sported SoCs, which stands for System-on-Chip, at their hearts consisting of all the basic hardware required for the phone to run including the processor, GPU, RAM, storage etc. And frankly, when there’s a better, modern solution available, it’s crazy to keep it around.” – Dan Riccio, Senior Vice President of Apple’s Hardware Engineering division, during the launch of the iPhone 7 back in 2016. It was fighting for space with camera technologies and processors and battery life. It was holding us back from a number of things we wanted to put into the iPhone. “ We’ve got this 50-year-old connector - just a hole filled with air - and it’s just sitting there taking up space, really valuable space.
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